{"id":14387,"date":"2018-05-30T11:44:53","date_gmt":"2018-05-30T11:44:53","guid":{"rendered":"https:\/\/ees.it\/?page_id=14387"},"modified":"2018-05-30T11:44:53","modified_gmt":"2018-05-30T11:44:53","slug":"testing-analysis","status":"publish","type":"page","link":"https:\/\/ees.it\/de\/testing-analysis\/","title":{"rendered":"Testing & Analysis"},"content":{"rendered":"

Testing & Analysis<\/h1>\n<\/div>
<\/div>
<\/div><\/div>
<\/div>

Die von EES durchgef\u00fchrten Kontrollen und Tests<\/strong><\/h3>\n<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/span><\/a><\/span>
<\/i><\/div>
<\/div>
<\/div>
<\/div>

Automatische optische Inspektion<\/strong><\/h2>\n<\/div>

Um die M\u00f6glichkeit zu minimieren, dass die Platinen Montage- und Schwei\u00dffehler aufweisen, bevor sie zum elektrischen Test und zu irgendwelchen Funktionstests geschickt werden, sendet EES nach dem Montageprozess SMT und legt alle Karten zur optischen Inspektion vor<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/span><\/a><\/span>
<\/i><\/div>
<\/div>
<\/div>
<\/div>

X-RAY Mikrofokusquelle Inspektion und Analyse<\/strong><\/h2>\n<\/div>

EES verwendet ein Mikrofokus-R\u00f6ntgensystem, um die Qualit\u00e4t der Schwei\u00dfn\u00e4hte zu \u00fcberpr\u00fcfen, die Gr\u00f6\u00dfe von Hohlr\u00e4umen zu bewerten, nach Fehlern zu suchen und die kritischen Punkte zu identifizieren, an denen die Reparatur von gedruckten Schaltungen, Steckverbindern und Verkabelung im Allgemeinen.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/span><\/a><\/span>
<\/i><\/div>
<\/div>
<\/div>
<\/div>

Testsystem mit mobilen Sonden<\/strong><\/h2>\n<\/div>

Um eine maximale Zuverl\u00e4ssigkeit der aus der Montagelinie kommenden elektronischen Baugruppen zu gew\u00e4hrleisten, ist EES in der Lage, elektrische Pr\u00fcfungen mit Hilfe von mobilen Pr\u00fcfk\u00f6pfen mit Hilfe einer Spea „Flying Probe 4040 Top Line“ -Maschine, einem Testsystem, durchzuf\u00fchren hohe Flexibilit\u00e4t und gleichzeitig niedrige Kosten.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/span><\/a><\/span>
<\/i><\/div>
<\/div>
<\/div>
<\/div>

Funktionstests zugeschnitten<\/strong><\/h2>\n<\/div>

Das hochspezialisierte technische Personal von EES ist in der Lage, jegliche Art von Funktionstests durchzuf\u00fchren, entweder unter Verwendung der vom Kunden bereitgestellten Spezifikationen und Ger\u00e4te, oder eigenst\u00e4ndig durch die Entwicklung spezieller Ger\u00e4te, die die verschiedenen erforderlichen Tests durchf\u00fchren k\u00f6nnen<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/span><\/a><\/span>
<\/i><\/div>
<\/div>
<\/div>
<\/div>

Stabilit\u00e4tstests mit Klimakammer<\/strong><\/h2>\n<\/div>

Dank der Klimakammer ACS „EOS 200 T“ k\u00f6nnen simulierte Umwelttests mit einstellbaren Temperaturzyklen (Bereich von -40 \u00b0 C bis + 180 \u00b0 C) durchgef\u00fchrt werden. Diese Tests erm\u00f6glichen es, alle latenten M\u00e4ngel des Produkts zu erkennen und die Robustheit der Komponenten zu bestimmen, was dazu beitr\u00e4gt, das Vertrauen in ihre Zuverl\u00e4ssigkeit zu st\u00e4rken.<\/p>\n<\/div>

<\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":6,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-14387","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"\nTesting & Analysis - Electronic Engineering Service<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ees.it\/de\/testing-analysis\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Testing & Analysis - Electronic Engineering Service\" \/>\n<meta property=\"og:url\" content=\"https:\/\/ees.it\/de\/testing-analysis\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Engineering Service\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/ees.spa.it\" \/>\n<meta name=\"twitter:label1\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data1\" content=\"7\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/ees.it\\\/de\\\/testing-analysis\\\/\",\"url\":\"https:\\\/\\\/ees.it\\\/de\\\/testing-analysis\\\/\",\"name\":\"Testing & Analysis - Electronic Engineering Service\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/ees.it\\\/#website\"},\"datePublished\":\"2018-05-30T11:44:53+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/ees.it\\\/de\\\/testing-analysis\\\/#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/ees.it\\\/de\\\/testing-analysis\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/ees.it\\\/de\\\/testing-analysis\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/ees.it\\\/de\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Testing & Analysis\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/ees.it\\\/#website\",\"url\":\"https:\\\/\\\/ees.it\\\/\",\"name\":\"Electronic Engineering Service\",\"description\":\"Apparecchiature e schede elettroniche\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/ees.it\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Testing & Analysis - Electronic Engineering Service","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/ees.it\/de\/testing-analysis\/","og_locale":"de_DE","og_type":"article","og_title":"Testing & Analysis - Electronic Engineering Service","og_url":"https:\/\/ees.it\/de\/testing-analysis\/","og_site_name":"Electronic Engineering Service","article_publisher":"https:\/\/www.facebook.com\/ees.spa.it","twitter_misc":{"Gesch\u00e4tzte Lesezeit":"7\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/ees.it\/de\/testing-analysis\/","url":"https:\/\/ees.it\/de\/testing-analysis\/","name":"Testing & Analysis - Electronic Engineering Service","isPartOf":{"@id":"https:\/\/ees.it\/#website"},"datePublished":"2018-05-30T11:44:53+00:00","breadcrumb":{"@id":"https:\/\/ees.it\/de\/testing-analysis\/#breadcrumb"},"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/ees.it\/de\/testing-analysis\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/ees.it\/de\/testing-analysis\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/ees.it\/de\/"},{"@type":"ListItem","position":2,"name":"Testing & Analysis"}]},{"@type":"WebSite","@id":"https:\/\/ees.it\/#website","url":"https:\/\/ees.it\/","name":"Electronic Engineering Service","description":"Apparecchiature e schede elettroniche","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/ees.it\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/pages\/14387","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/comments?post=14387"}],"version-history":[{"count":2,"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/pages\/14387\/revisions"}],"predecessor-version":[{"id":14389,"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/pages\/14387\/revisions\/14389"}],"wp:attachment":[{"href":"https:\/\/ees.it\/de\/wp-json\/wp\/v2\/media?parent=14387"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}