{"id":11532,"date":"2012-01-22T23:29:57","date_gmt":"2012-01-22T23:29:57","guid":{"rendered":"http:\/\/www.ees.it\/?page_id=11532&lang=en"},"modified":"2018-05-30T09:59:45","modified_gmt":"2018-05-30T09:59:45","slug":"engineering","status":"publish","type":"page","link":"https:\/\/ees.it\/en\/engineering\/","title":{"rendered":"Engineering"},"content":{"rendered":"

Engineering<\/h1>\n<\/div>
<\/div>
<\/div><\/div>
<\/div>

Mechatronic engineering and support structure for all NPI phases<\/strong><\/h3>\n<\/div>
<\/div><\/div><\/div><\/div><\/div>

EES offers a service of PCB master layout design plan:<\/p>\n

Available CAD Packets:
\n<\/strong><\/p>\n

    \n
  • Expedition PCB Mentor Graphics<\/li>\n
  • Pads\u00a0Mentor Graphics<\/li>\n
  • Visula Zuken<\/li>\n
  • ORCAD<\/li>\n
  • VALOR Mentor Graphics (per Analisi DFM-DFA-DFT)<\/li>\n<\/ul>\n

    Input data:<\/strong><\/p>\n

      \n
    • Electrical layout in ORCAD format, (in alternative DX Designer, Board Architect)<\/li>\n
    • Technical specifications to guide the PCB projects (layout, lay-up, typology of the requested impedance check, assembly constrains and checks)<\/li>\n
    • PCB assembly specifications<\/li>\n
    • Mechanical drawing of the PCB<\/li>\n
    • Libraries of components if existing or precise indications of the adopted components<\/li>\n
    • CAD Mentor or Expedition package or Visula containing: layout, netlist,\u00a0libraries, board size and essential constrains<\/li>\n<\/ul>\n

      Output data:<\/strong><\/p>\n

        \n
      • Blocco CAD nel formato BOARD STATION, EXPEDITION, VISULA.<\/li>\n
      • File GERBER per la costruzione del PCB, file di foratura, file per P&P, file lamine serigrafiche, specifica di costruzione PCB<\/li>\n
      • File ODB++ ( che comprende tutti i dati atti a realizzare i PCB, il pilotaggio della P&P, le specifiche di costruzione, i test elettrici e funzionali<\/li>\n<\/ul>\n

        PCB project\u2019s parallel activities:<\/strong><\/p>\n

          \n
        • Realization of library documentation of components in IPC 7351 or as specified by the customer<\/li>\n
        • Pre and Post layout simulation for High Speed digital (these are tools that, during the project phase, help overcoming problems such as delay in transmission lines, crosstalk, ground bounce or EMI problems)<\/li>\n
        • DFM-DFA-DFT analysis (tools that guarantee the control of the project in terms of feasibility of production, assembly and testing of the PCB)<\/li>\n<\/ul>\n<\/div>
          <\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-11532","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"\nIngegnerizzazione<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ees.it\/en\/engineering\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Ingegnerizzazione\" \/>\n<meta property=\"og:url\" content=\"https:\/\/ees.it\/en\/engineering\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Engineering Service\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/ees.spa.it\" \/>\n<meta property=\"article:modified_time\" content=\"2018-05-30T09:59:45+00:00\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/ees.it\\\/en\\\/engineering\\\/\",\"url\":\"https:\\\/\\\/ees.it\\\/en\\\/engineering\\\/\",\"name\":\"Ingegnerizzazione\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/ees.it\\\/#website\"},\"datePublished\":\"2012-01-22T23:29:57+00:00\",\"dateModified\":\"2018-05-30T09:59:45+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/ees.it\\\/en\\\/engineering\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/ees.it\\\/en\\\/engineering\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/ees.it\\\/en\\\/engineering\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/ees.it\\\/en\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Engineering\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/ees.it\\\/#website\",\"url\":\"https:\\\/\\\/ees.it\\\/\",\"name\":\"Electronic Engineering Service\",\"description\":\"Apparecchiature e schede elettroniche\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/ees.it\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Ingegnerizzazione","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/ees.it\/en\/engineering\/","og_locale":"en_US","og_type":"article","og_title":"Ingegnerizzazione","og_url":"https:\/\/ees.it\/en\/engineering\/","og_site_name":"Electronic Engineering Service","article_publisher":"https:\/\/www.facebook.com\/ees.spa.it","article_modified_time":"2018-05-30T09:59:45+00:00","twitter_misc":{"Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/ees.it\/en\/engineering\/","url":"https:\/\/ees.it\/en\/engineering\/","name":"Ingegnerizzazione","isPartOf":{"@id":"https:\/\/ees.it\/#website"},"datePublished":"2012-01-22T23:29:57+00:00","dateModified":"2018-05-30T09:59:45+00:00","breadcrumb":{"@id":"https:\/\/ees.it\/en\/engineering\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/ees.it\/en\/engineering\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/ees.it\/en\/engineering\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/ees.it\/en\/"},{"@type":"ListItem","position":2,"name":"Engineering"}]},{"@type":"WebSite","@id":"https:\/\/ees.it\/#website","url":"https:\/\/ees.it\/","name":"Electronic Engineering Service","description":"Apparecchiature e schede elettroniche","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/ees.it\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"_links":{"self":[{"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/pages\/11532","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/comments?post=11532"}],"version-history":[{"count":6,"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/pages\/11532\/revisions"}],"predecessor-version":[{"id":14279,"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/pages\/11532\/revisions\/14279"}],"wp:attachment":[{"href":"https:\/\/ees.it\/en\/wp-json\/wp\/v2\/media?parent=11532"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}