The main features of this machine are:
- Temperature control in closed-loop
- Registration at not-contact component temperature combined with infrared sensor (IRS) and the thermocouple
- IR emitters upper and lower having a developed power of 800W each
- Process window close – for lead-free soldering
- Complete documentation of the process IRSoft.
EES also has a machine for BGA reballing, with the help of custom plates and an forced-air oven, allows the reconstruction of the balls of a BGA.