Il nostro assemblaggio standard rispetta le direttive RoHS. Per assemblaggio in stagno Piombo selezionare la casella apposita e fornire in fase d’ordine la deroga in Vs possesso.
L’azienda è certificata ISO9001 e gli assemblaggi sono fatti secondo Standard IPC-A-610.

Abbiamo due tempi di consegna: General Lead Time e Final Lead Time.
Il General Lead Time è il tempo di assemblaggio dei componenti sulla PCB: Fast prototyping è di 2 giorni lavorativi, Fast di 5 giorni, Standard di 10 giorni. Il Final Lead Time è il General Lead Time sommato al tempo di approvvigionamento materiale.

Compilare il modulo per una quotazione immediata:

Codice Scheda
Codice Scheda e/o Descrizione
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Revisione
Revisione
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Classe IPC
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Tecnologia
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Misure Pannello

Selezionare il range delle dimensioni x,y del vostro pannello (dovrà essere più grande di 50mm x 80 mm). Il pannello è l'insieme delle PCB inquadrottate. Es. PCB 40 x 60 in un pannello formato da 5 x 3 figure avrà una dimensione 200 x 180 mm.
Dimensioni x, y Pannello
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Spessore PCB
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Figure per pannello
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Righe BOM

Inserire il numero di componenti diversi per scheda, generalmente corrispondono agli "item" della BOM (lista componenti)
n° item
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SMD

Indicare la quantità di componenti SMD (con pads visibili) presenti su una scheda. I componenti SMD (Surface Mounting Device) sono quei componenti a montaggio superficiale (es. di Package SMD: 0201, 0402, 0805, Sot23, DPAK, SO8, SSOP16…). EES si avvale di macchine Pick&Place MyCronic di ultima generazione ad altissima precisione per il piazzamento dei componenti. Per ogni nuovo prodotto viene sviluppato un programma serigrafico con ispezione ottica al 100%, un programma P&P con le coordinate dei componenti ed un profilo di saldatura per la rifusione (costo non ricorrente).
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Presenti su
Indicare se i componenti sono presenti sul Top, sul Bot o entrambi i lati
Indicare se i componenti sono presenti sul Top, sul Bot o entrambi i lati

BGA/LGA/QFN/DFN/LCC

Indicare tutti i componenti presenti sulla PCBA (printed circuit board assembly) con le pad coperte dal corpo del componente. EES prevede per questi componenti l'ispezione tramite X-RAY Nikon XTV 160 al 100% per prototipi e piccole serie, in AQL per le produzioni (% AQL definita in accordo con il cliente in fase di offerta). Questi componenti possono essere in tecnologia BGA/μBGA (Ball Grid Array), LGA (Land Grid Array), QFN (Quad Flat no Lead), DFN (Dual Flat no Lead), LCC (Leadless Chip Carrier).
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THT

Indicare i componenti THT (Through-Hole Technology) presenti sulla PCBA. I componenti THT sono quei componenti che presentano pin/reofori a saldare che necessitano di fori sulla PCB (Es. Resistenze assiali o radiali, TO-220, TO-264, DIP8, DIP16...). EES si avvale di macchine sellettive (ERSA ECOSELECT 2) o saldatrici ad onda e personale addestrato per la saldatura tramite micro saldatori. Se richiesto, in fase d’offerta automatica, indicare i punti saldatura (la somma dei pin di tutti i componenti THT presenti su una PCBA).
Quantità
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Presenti su
Indicare se i componenti sono presenti sul Top, sul Bot o entrambi i lati
Indicare se i componenti sono presenti sul Top, sul Bot o entrambi i lati
N° p.ti Saldatura
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PRESSFIT

Indicare i componenti con Tecnologia Press-Fit presenti su una PCBA. I componenti Press-Fit, come i componenti THT, sono caratterizzati da reofori e necessitano di fori sulla PCB (con una tolleranza decisamente più ristretta), ma la particolare forma del reoforo gli permette di essere inserito a pressione (con una pressa specifica e con l’ausilio di un’attrezzatura custom) senza essere saldato.
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Test AOI 3D + X-RAY 3D

Tramite ispezione Ottica automatica (AOI - Automated Optical Ispection system) si verifica la qualità della saldatura (analisi del menisco), posizionamento dei componenti secondo IPC A 610 ed orientamento dei componenti polarizzati. Il sistema AOI adoperato da EES sfrutta la tecnologia 3D di SAKI BF-3Di, che permette non solo un’ispezione ottica, ma una vera e propria misurazione in tre dimensioni riuscendo così a ridurre sensibilmente le possibili difettosità di assemblaggio. Questo Test prevede un costo non ricorrente per la programmazione della macchina. Se non viene richiesto l’AOI verrà eseguita un'ispezione visiva non automatica, con l'ausilio di un visore. In presenza di componenti con saldature coperte da corpo viene fatta un'ispezione X-RAY al 100% su pochi pezzi e con % AQL intelligente (selezionabile) su grandi quantità.
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Test Elettrico a Sonde Mobili

Al fine di garantire la massima affidabilità delle schede elettroniche in uscita dalla propria linea di montaggio, EES è attrezzata per poter fare verifiche elettriche tramite sonde mobili con l'ausilio di una macchina Spea “Flying Probe 4040 Top Line”, un sistema di test ad elevata flessibilità e nel contempo a costi contenuti. Le principali caratteristiche della Flying Probe 4040 sono: Contattazione contemporanea dei due lati della scheda (TOP e BOTTOM), Produttività elevata grazie ai motori lineari con cuscino magnetico ed encoder lineari su ogni asse X,Y,Z con risoluzione di 0.1 um, Area di test sino a 686x610mm, On Board Program, Boundary Scan, Test NZT (Nodal Impedance Test), Test ICT, parametrico.
ICT
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Net
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Copertura Test Point
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Note
Scrivere note aggiuntive/informative del prodotto
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General Lead Time
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Generla Lead Time
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Generla Lead Time
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Generla Lead Time
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Generla Lead Time
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Generla Lead Time
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Margine Materiale/PCB:
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costo unitario KIT (€)
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quantità KIT:
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Lead Time Materiale (Giorni)
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Costo Attrezzatura PCB (€)
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costo unitario PCB (€)
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quantità PCB
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Lead Time PCB (Giorni)
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Costo Verniciatura unità (€)
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Unità da verniciare
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Lead Time (Giorni)
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CU assiemmaggio/cablaggio
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Quantità Assiemaggi/cablaggi
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Lead Time (Giorni)
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Costo Attrezzatura di collaudo (€)
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Tempo unitario per collaudo (min)
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q.tà pcb/apparati da collaudare
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costo orario (€)
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Costo Progettazione
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Lead Time (Giorni)
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Costo ingegnerizzaione
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Lead Time PCB (Giorni)
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Altra Lavorazione:
descrizione breve
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costo totale altra lavorazione
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Lead Time (Giorni)
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Altra Lavorazione:
descrizione breve
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costo totale altra lavorazione
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Lead Time (Giorni)
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Costo Unitario KIT
€0.00
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Costo Totale KIT
€0.00
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Costo Attr. PCB
€0.00
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PCB unitaria:
€0.00
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Costo Totale PCB
€0.00
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Costo Orario UTP (€)
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Costo Orario Operatore (€)
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Lati da doc. : 0
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Start Documentazione
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Tempo a Lato
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Tempo a riga
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Tempo a Lato Smd
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Tempo a riga smd
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Start AOI
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Tempo a Lato AOI
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Tempo a componente SMD
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Start ICT
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Tempo a Lato
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Tempo a NET
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Tempo Debug a NET
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Costo Orario SMD (€)
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MIN Comp./Ora
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MAX Comp./Ora
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0 cmp/h
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tempo a platou
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Costo Orario AOI (€)
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MIN Comp./Ora
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MAX Comp./Ora
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0 cmp/h
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Tempo CV a componente
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Tempo XRAY a comp
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Costo Orario ICT (€)
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MIN Net/Ora
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MAX Net/Ora
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0net/h
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Tempo MAX a PreesFit
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Tempo min a Pressfit
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0 sec/Press
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Costo orario THT (€)
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MIN Comp./Ora
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MAX Comp./Ora
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Tempo min a P.to Sald
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Tempo MAX a P.to Sald
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0 cmp/h
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0 sec/p.to
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Tempo min a fix Mec
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Tempo MAX a fix Mec
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0 sec/mec
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Tempo min. imballo
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Tempo MAX a Imballo
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0.0PCB/min
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Pendenza curva
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0.000000Curva
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comp. smd a scheda: 0
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comp. smd totali: 0
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comp. BGA totali: 0
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P.Sald (Unit): 0
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P.Sald (Tot): 0
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comp. THT: 0
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Fissaggi Meccanici:0
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Pressfit Totali:0
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NET a scheda: 0
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NET Totali: 0
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Nuovo Prodotto
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Efficienza P&P
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Costo lamina serigrafica
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Tipo telaio serigrafico:
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Attrezzature Pressfit
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Costo Attr. Pressfit
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q.tà platou: 0
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q.tà pannelli: 0
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Costo Platou per Sostegno PCB
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c.SMD:0.00€cent
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c.AOI:0.00€cent
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c.tht:0.00€
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€cent/net:0.00
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Tempistiche

Tempo Doc. Base0.0 ore
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Tempo Prog. P&P0.0 ore
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Tempo Prog. AOI0.0 ore
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Tempo Prog. ICT0.0 ore
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Tempo Debug ICT0.0 ore
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Tempo Avvio:0.00 ore
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Tempo Imballo0.000 ore
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Tempo Avvio SMD:0.00 ore
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Tempo SMD0.000 ore
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Tempo AOI/CV0.000 ore
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Tempo XRAY0.000 ore
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% XARY0%
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Tempo Avvio ICT:0.000 ore
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Tempo ICT0.000 ore
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Tempo Avvio THT:0.00 ore
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Tempo THT0.000 ore
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Tempo Totale Non Ricorrenti
0.0 ore
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Tempo totale ricorrenti
0.0 ore
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Giorni lavorativi
0.00 giorni
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Costi

Costo Doc. Base€0.00
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Costo Prog. SMD€0.00
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Costo Doc. con margine:€0.00
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Costo Prog. AOI€0.00
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con margine:€0.00
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Costo Prog. ICT€0.00
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con margine:€0.00
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Tot. Documentazione
€0.00
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Margine
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Fattore lead time
0.0
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Costo Lamine / Telai€0.00
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con margine: €0.00
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Costo Attr. Pressfit€0.00
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con margine: €0.00
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Costo Platou€0.00
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con margine:€0.00
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Attrezzature
€0.00
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Fattore Classe 3 IPC0.00
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Costo Avvio: €0.00
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Costo SMD (con Avvio)€0.00
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Costo Controllo€0.00
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Costo THT€0.00
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Costo totale imballo€0.00
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Assemblaggio scheda elettronica con controllo AOI e XRAY€0.00
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Costo Test ICT€0.00
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con margine: €0.00
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Tot. Non Ricorrenti
€0.00
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Tot. Ricorrenti
€0.00
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Ricorrenti Unitario
€0.00
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Totale
€0.00
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Azienda
Regione Sociale
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Riferimento
Nome e Cognome
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eMail
Your Email Address
formato errato
formato errato
Telefono
mobile o fisso
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BOM Assembly file
Formati: .xls.xlsx.txt.bom
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PCB Gerber file
Formato 274X, con files di aperture allegato
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ODB ++
Formati: .tgz.rar.zip.odb
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Richieste Speciali
Richieste Speciali
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Privacy
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Invia

Per una quotazione più precisa o per usufruire di altri nostri servizi (approvvigionamento materiale, acquisto PCB, Test funzionali su specifica, Reballing, Rework…) compilare il modulo preventivo (link) o scrivere all’indirizzo mail sales@ees.it.