The first feature of the MYCRONIC line is setup quickness. In fact, the Agilis intelligent loaders and the rapid assembly of data for assembly (from CAD, with the aid of Moror and MYCenter’s Valor Process Preparation) make it the ideal machine to make rapid prototyping, but not only, in fact with a production capacity of 64,000 CPH we are able to offer fast service even for production, guaranteeing precision (35 μm, 0.09 °) and repeatability of the process (21 μm, 0.05 °) that characterize the quality of EES products. In addition, the intelligent chargers make it possible to offer a “traciability” of the components that, with the help of the company MRP, provide total traceability (component traceability + process traceability).
Even though with different characteristics, which make them more suitable for standard assembly, the three I-PULSE machines are also synonymous with precision, reliability and repeatability.
The I-Pulse line that includes M1P + M2 + M4e has been designed to have a strong feeder capacity (380 feeder + Tray Feeder with 40 trays capacity) and to be able to mount boards with many types of SMD components with just one machine load that to make the rated speed (Rated Speed) equal to 66,000 CPH very close to the actual speed.
Another highlight of the smt line is undoubtedly the Versaprint S1 silkscreen by ERSA, which thanks to the scanner and the continuous pressure control of the squeegee guarantees 100% control of the process (control of the dough on the board and the cleaning of the plate, activating automatic washes). Moreover the precision of ± 25 μm @ 6 Sigma allows to have a highly repeatable serigraphy even on steps (pitch) 0.2mm.
In support of ERSAS we have the Speedprint SP210avi silk-screen, today it is used for machining operations that do not involve technologies that are not excessively strong.
Finally, EES has recently decided to invest in the Vapour-Phase Soldering System technology, which guarantees excellent temperature uniformity, focusing on the ASSCON VP800 oven. Vaphour Phase welding is the best technology to weld complex components such as BGA, QFP, QFN, POP etc, on densely populated boards with a wide variety of components.
Moreover, the Vapor Phase welding is very useful in the welding of devices where it is necessary to dissipate power (for example power LED diodes, D2PACK OR D3PACK) in fact the presence of Void, extremely dangerous in power circuits, with welding in Vapor Phase technology it reduces a lot.
Furthermore, the absence of oxygen during the recasting phase reduces oxidation problems.